Semiconductor Packaging and Testing
Wuyuan Semiconductor Technology (Qingdao) Co., Ltd. was established in May 2022. As a key leading enterprise in Qingdao’s new-generation information technology industry chain, it focuses on wafer-level advanced packaging and 3D integrated circuits, with hybrid bonding as its core technology. The company has built the first 12-inch hybrid bonding advanced packaging pilot line in China, supporting the improvement of the domestic semiconductor industry chain.
The UPW system of this project is part of Wuyuan’s 12-inch integrated circuit production line project and FAB plant construction project. It covers the construction of the UPW system and UPW Loop water distribution system to meet the capacity requirement of 30K (IGBT) + 10K (WOW) in Phase I, as well as the RCL (F/L Rinse) recovery and supply system and LSR recycled water supply system.
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UPW/Recycled Water Project of Forehope
This project involves the UPW and intermediate water reclamation system for an annual production capacity of 13 billion microelectronic integrated circuit (IC) package testing.
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