04
2020
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09
TG Environment assists Shandong GRINM in successfully pulling the first 8-inch Czochralski (CZ) monocrystalline silicon ingot for integrated circuits!
Author:
On September 1, Shandong GRINM Semiconductor Materials Co., Ltd. (hereinafter referred to as "Shandong GRINM") officially announced the successful pulling of the first 8-inch Czochralski (CZ) monocrystalline silicon ingot for integrated circuits at its "Large-scale Production Project for Large-diameter Silicon Materials for Integrated Circuits" facility. This achievement marks a key breakthrough for Shandong's integrated circuit industry and signifies significant progress in this major project for replacing old growth drivers with new ones, which ranks first on the provincial list of key projects. With this success, the project is now poised to enter the mass production phase.
On September 1, Shandong GRINM Semiconductor Materials Co., Ltd. (hereinafter referred to as "Shandong GRINM") officially announced the successful pulling of the first 8-inch Czochralski (CZ) monocrystalline silicon ingot for integrated circuits at its "Large-scale Production Project for Large-diameter Silicon Materials for Integrated Circuits" facility. This achievement marks a key breakthrough for Shandong's integrated circuit industry and signifies significant progress in this major project for replacing old growth drivers with new ones, which ranks first on the provincial list of key projects. With this success, the project is now poised to enter the mass production phase.
TG Hylite Environment Technology Co., Ltd., as a long-term service provider for Beijing GRINM's UPW system, participated in and undertook the design and construction of the UPW system for this project in July 2019.
TG Environment adopted a mature and reliable, fully automated water treatment process for UPW production, featuring pretreatment + DPRO + EDI + polishing. This process not only meets all the technical specifications for UPW but also boasts characteristics including high water utilization rates, stable operation, and ease of maintenance and management. Under the joint efforts of TG Environment and the owner's technical team, the entire project was designed using BIM software tools. This approach accelerated the overall project schedule and addressed spatial management issues during construction. The project team from TG Environment overcame disruptions caused by the pandemic, closely coordinated efforts, and meticulously carried out construction. They fully met the user's requirements in terms of schedule and quality, earning high recognition from the client.
This year, while effectively taking comprehensive epidemic prevention actions, TG Environment has overcome numerous difficulties and pressures to complete construction tasks on time, to high quality standards, and within schedule, demonstrating our consistent commitment to our clients. In the future, with a commitment to our original mission and the goal of creating high-quality projects, we will continue to deliver superior and professional technical services to clients including Shandong GRINM, thereby realizing our mission to "Create Customer Value with Technology and Service".
[Project Background]
Shandong GRINM Semiconductor Materials Co., Ltd., a core enterprise under GRINM Group, achieved several milestones in the domestic semiconductor industry. It successfully produced China's first 6-inch, 8-inch, 12-inch, and 18-inch Czochralski (CZ) monocrystalline silicon ingots in 1992, 1995, 1997, and 2002, respectively. This company was also the first in China to achieve large-scale production of 8-inch silicon wafers.
The Shandong GRINM Large-Scale Production Project for Large-Diameter Silicon Materials for Integrated Circuits is part of the relocation of Beijing's high-tech industries. The first phase of the project, with a total investment of CNY1.8 billion, commenced construction in March 2019 and includes production lines for an annual capacity of 2.76 million 8-inch silicon wafers and 1.8 million 6-inch silicon wafers, as well as a production line for 300 tons of 12-inch to 18-inch large-diameter monocrystalline silicon ingots. Currently, the project is undergoing finalization work, with some process equipment entering the trial operation stage. Preparations for the second phase, which will focus on 12-inch silicon wafers for integrated circuits, are actively underway, with construction slated to begin next year.
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